Research & Publications

Engineering Backed by Published Science

EW JET's thermal development is grounded in peer-reviewed research, conference publications, and granted patents. Our products are built on a foundation of validated thermal physics and protected IP.

Patents & IP

Taiwan · TWI925595BGrantedInvention Patent

Heat Pipe Structure

熱管結構

Application No. TW114113631 · Filed April 10, 2025 · Granted May 11, 2026

Inventor: Lin, Ho-Chuan (林河川) · Applicant: EW JET PRODUCTS CO., LTD.

F28D 15/02F28D 15/04F28F 1/10F28F 9/013
I925595

Official Certificate

EW JET Patent Certificate TWI925595B — Heat Pipe Structure

Active R&D Areas

3D-Printed Wick Optimization

Ongoing development of capillary wick geometries using additive manufacturing — maximizing transport capacity while minimizing thermal resistance.

High-Flux Heat Pipe Design

Research into heat pipe configurations capable of handling heat fluxes beyond 30 W/cm² for next-generation high-power electronics.

AI Server Thermal Integration

Development and testing of modular heat pipe coupling interfaces for GPU and AI accelerator packages in rack-mounted configurations.

PCM Material Selection

Evaluation of phase change materials for different mission temperature profiles — satellite payloads and edge AI systems have distinct PCM requirements.

Long-Duration Space Testing

Life-testing and accelerated aging of AL-NH₃ heat pipes under simulated space thermal cycling to validate 15+ year mission life.

Custom Geometry Development

Engineering of flat, curved, and complex-geometry heat pipes enabled by 3D-printed wicks for spacecraft structural integration.

R&D Services

Custom R&D & Prototype Engineering

EW JET offers custom R&D and prototype services. From concept thermal simulation through prototype build and performance measurement — we act as a technical engineering partner, not a commodity vendor.

Thermal simulation & CFD modeling
Custom heat pipe design
Prototype fabrication
Performance measurement & characterization
Qualification testing support
Technical documentation

Interested in collaborating?

We're open to research partnerships, joint development programs, and academic collaborations in thermal engineering.

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